| 01 | Precision FAU manufacturer | Fiber arrays assembled with controlled pitch and alignment; configurations may use V-groove substrates. | Provides the fiber-to-photonic-device interface used in optical packaging. | Fiber pitch, end-face quality, insertion loss, alignment tolerances, and inspection data. |
| 02 | High-density fiber-array specialist | Multi-fiber arrays and custom fiber layouts for parallel optical coupling. | Supports dense optical I/O for co-packaged and near-packaged designs. | Channel count, array geometry, repeatability, fiber routing, and assembly yield. |
| 03 | Optical interconnect and ferrule supplier | Multi-fiber ferrules, connector components, and fiber-interconnect assemblies. | Can provide detachable or factory-assembled fiber connections around optical modules. | Mating compatibility, cleanliness controls, connector loss, and serviceability. |
| 04 | Silicon photonics foundry | Photonic integrated circuit fabrication and process access for silicon-photonics designs. | Supplies PICs that may be incorporated into optical engines for CPO or NPO systems. | Process design kit, supported device library, wafer access, design rules, and production controls. |
| 05 | Optical-engine and PIC integrator | Integrated optical subassemblies combining photonic devices with electrical and optical interfaces. | Develops the optical engine used near or within a host switch or computing package. | Optical performance, electrical interface, thermal behavior, test coverage, and roadmap maturity. |
| 06 | Advanced photonic packaging provider | Die placement, optical attach, package assembly, and process development for photonic devices. | Enables close integration of optical engines and electronic packages in CPO or NPO assemblies. | Assembly tolerances, process repeatability, qualification data, yield, and volume readiness. |
| 07 | Laser and external-light-source supplier | Continuous-wave laser components or source assemblies for optical transmission systems. | Can provide optical power to architectures that use external laser sources. | Wavelength, output power, operating life, redundancy options, and thermal requirements. |
| 08 | Optical-assembly automation provider | Precision alignment, active coupling, bonding, and inspection equipment or contract assembly services. | Addresses the alignment and repeatability demands of FAU and optical-engine assembly. | Alignment accuracy, cycle time, process monitoring, recipe control, and production scalability. |
| 09 | Photonic test and measurement supplier | Optical power, wavelength, loss, and related component or assembly test equipment. | Supports characterization and production screening of PICs, FAUs, and optical engines. | Measurement range, calibration, automation interfaces, test time, and data traceability. |
| 10 | Thermal and package-material supplier | Thermal interface materials, package substrates, lids, and mechanical components. | Helps manage heat and mechanical constraints around densely integrated optical and electronic assemblies. | Thermal performance, dimensional stability, material compatibility, reliability, and supply continuity. |