| Profile A | Silicon RF integrated passive device on a standard CMOS-compatible process | Approximately 0.5–15 nH | Up to several GHz, depending on layout and substrate | Medium | Standard spiral inductors; limited geometry options | Not publicly disclosed | Medium Layout, metal stack, and pad changes generally possible | About 8–14 weeks after design approval | RF matching, oscillators, filters, and wireless modules |
| Profile B | High-resistivity silicon substrate with thick-metal RF inductors | Approximately 1–30 nH | Hundreds of MHz to several GHz | Medium to High | Broad spiral geometry portfolio with multiple metal options | Not publicly disclosed | High Custom inductance, Q-factor, footprint, and pad configuration | About 10–16 weeks after design approval | Automotive RF, connectivity, sensing, and power-management ICs |
| Profile C | Wafer-level silicon micromachined or suspended-structure inductor | Approximately 2–50 nH | Hundreds of MHz to low-GHz applications | High potential | Specialized high-Q structures; fewer catalog configurations | Not publicly disclosed | High Strong design flexibility, but process qualification is required | About 12–20 weeks after design approval | Low-loss RF front ends, resonators, and research-to-production programs |
| Profile D | Silicon-based integrated passive component with standard backend metallization | Approximately 0.3–10 nH | Up to several GHz, subject to parasitic limits | Medium | Compact standard cells with moderate design variation | Not publicly disclosed | Medium Best suited to platform-based customization | About 6–12 weeks after design approval | Consumer electronics, IoT modules, and compact RF devices |
| Profile E | Custom silicon interposer or advanced-package embedded inductor | Approximately 1–100 nH, depending on package architecture | From low MHz to several GHz | Medium to High | Package-level and module-level structures; wide physical-format range | Not publicly disclosed | High Package stack-up, routing, thermal, and mechanical co-design | About 10–18 weeks after design approval | Power modules, SiP products, antenna modules, and high-density packages |