| Ambient temperature | IEC 61439 normal service conditions allow an ambient temperature up to 40°C, with a 24-hour average not exceeding 35°C. | Confirm that the installation location does not exceed 40°C under normal operating conditions. Higher temperatures require a specific design assessment. | Maximum ambient: 40°C 24-hour average: ≤35°C | Mandatory input |
| Rated current of the assembly | The rated current and diversity of outgoing circuits determine conductor, busbar and device losses. | Use the actual simultaneous load current rather than the sum of all circuit ratings. Check the continuous current of the incomer, busbars and feeders. | Incomer rating: 400 A Calculated continuous load: 320 A Diversity factor: 0.80 | Verify by design |
| Total internal power loss | Thermal performance depends on the heat generated by circuit-breakers, contactors, terminals, busbars, cables and auxiliary equipment. | Add the heat losses of all continuously energized devices and conductors. Use manufacturer-certified loss data for each component where available. | Device losses: 210 W Busbar and cable losses: 90 W Auxiliary losses: 25 W Total design loss: 325 W | Calculate before selection |
| Enclosure volume | The available heat-dissipation area and internal air volume affect the temperature rise. A larger enclosure generally provides better natural convection. | Compare the internal volume and usable mounting area with the calculated heat loss. Do not judge thermal capability from external dimensions alone. | Internal dimensions: 1,800 × 800 × 300 mm Approximate internal volume: 0.432 m³ | Check the thermal model |
| Cooling method | Natural ventilation, forced ventilation and air-conditioning produce different thermal results and environmental protection levels. | Select a cooling method that can remove the calculated heat at 40°C. Filtered fans and air-conditioning require maintenance and auxiliary power. | Natural convection: suitable for low-to-moderate losses Filtered fan: used when natural cooling is insufficient Air-conditioner: used for high losses or tightly sealed enclosures | Match cooling to heat load |
| Temperature-rise verification | IEC 61439 requires verification of temperature-rise performance by an applicable verification method, such as testing, comparison with a tested design or calculation. | Confirm that the calculated or tested temperature rise remains within the limits applicable to the installed components, conductors, terminals and accessible surfaces. | Ambient reference: 40°C Example calculated internal air rise: 28 K Estimated internal air temperature: 68°C | Document verification |
| Component temperature rating | Individual devices and accessories have their own operating-temperature limits and derating requirements. | Check the operating temperature and current derating curve for every major device. The lowest applicable component limit governs the design. | Ambient plus internal rise: 68°C Device-specific rating and derating: must be confirmed from technical documentation | Use component data |
| Busbar and conductor sizing | Current-carrying capacity is affected by conductor material, cross-section, arrangement, spacing, enclosure conditions and operating temperature. | Check continuous current, short-circuit withstand, joint heating and proximity effects. Avoid selecting busbars only from the nominal current value. | Copper busbar system: 400 A design rating Continuous operating current: 320 A Joint and connection temperatures: included in verification | Verify thermal and fault ratings |
| Ingress protection versus cooling | A higher IP rating can restrict airflow and increase internal temperature. The required IP rating depends on the installation environment. | Balance dust and water protection with heat dissipation. Ventilation openings must not compromise the specified IP rating. | Indoor clean electrical room: IP31–IP42 may be suitable Dust or water exposure: higher IP rating may be required Final rating: project and site dependent | Select IP and cooling together |
| Installation arrangement | Wall-mounted, floor-standing, adjacent or enclosed assemblies have different heat-transfer conditions. | Allow the required clearance around the enclosure. Do not block ventilation paths or install heat-producing sections directly below sensitive devices without assessment. | Side clearance: according to the tested or calculated design Top ventilation: kept unobstructed where required Adjacent heat sources: included in the assessment | Confirm site layout |
| Short-circuit withstand | Thermal design does not replace verification of short-circuit withstand for the assembly and its internal conductors. | Check short-time withstand current, peak withstand current and protective-device coordination for the prospective fault level. | Prospective short-circuit current: 25 kA Required withstand rating: not less than the calculated fault level | Separate mandatory check |
| Thermal margin | A design margin helps accommodate load variation, blocked ventilation, connection resistance and future circuit additions. | Avoid operating continuously at the calculated thermal limit. Recalculate if the load, enclosure layout, IP rating or cooling method changes. | Recommended engineering practice: reserve capacity for future load growth and installation tolerances | Keep practical margin |
| Required documentation | The final assembly design should have traceable evidence for ratings, construction, verification and operating conditions. | Retain temperature-rise calculations or test evidence, component loss data, current ratings, IP evidence, fault ratings and installation instructions. | Design file includes: thermal calculation, layout, ratings, test or comparison evidence, maintenance requirements | Complete before approval |